【1】Wei YG,Hutchinson JW. Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity;Journal of Mech. Phys. Solids, Vol.45, 1253-1273, 1997.
【2】Wei YG,Hutchinson JW. Interface strength,work of adhesion and plasticity in the peel test.Int. Journal of Fracture, Vol.93, 315-333, 1998.
【3】Wei YG, Xu G, A multiscale model for the ductile fracture of crystalline materials;International Journal of Plasticity, Vol.21, 2123-2149, 2005.
【4】Wei YG. A new finite element method for strain gradient theories and applications to fracture analyses.Eur. J. Mech. A/Solids, Vol.25, 897-913, 2006.
【5】Cao AJ,Wei YG, Mao SX. Deformation mechanisms of face-centered-cubic metal nanowires with twin boundaries.Applied Physics Letters, Vol.90, 151909, 2007.
【6】Wei YG;Zhao HF, Peeling experiments of ductile thin films along ceramic substrates --Critical assessment of analytical models. International Journal of Solids & Structures Vol.45, 3779~3792, 2008.
【7】Wu B, Liang LH, Ma HS,Wei YG, A trans-scale model for size effects and intergranular fracture in nanocrystalline and ultra-fine polycrystalline metals,Computational Materials ScienceVol.57, 2–7, 2012.
【8】Liang LH, Li XN, Liu, HY, Wang YB,Wei YG, Power-law characteristics of damage and failure of ceramic coating systems under three-point bending,Surface & Coatings TechnologyVol.285, 113–119, 2016.
【9】Wang GR, Dai ZH, Wang YL, Tan PH, Liu LQ, Xu ZP,Wei YG,Huang R, Zhang Z, Measuring interlayer shear stress in bilayer graphene.Physical Review Letters; Vol.119: 036101, 2017.
【10】Ma HS, Hu GK,Wei YG,Liang LH, Inclusion problem in second gradient elasticity,International Journal of Engineering Science;Vol.132, 60–78, 2018
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