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报告内容摘要：
The aim of the research is to understand, describe, predict and optimize the mechanical response of the materials, products, and (micro-)systems of the future as a function of their underlying microstructure, processing and evolution. Example of such materials or systems are advanced high strength steels for lighter and simultaneously stronger cars, metallic micro-electromechanical systems (MEMS) for better signal reception in mobile phones, or flexible and stretchable electronics for all kind of futuristic applications including electronic paper. In order to unravel the often complex phenomena that occur at the micron scale, it is crucial to integrate the measurement of (local) forces and strains under complex loading conditions and simultaneously visualize the deformations of the microstructure using various kinds of microscopes. Therefore, a main challenge in the research is to develop novel, advanced measurement methodologies that enable such an integrated mechanical-microscopic approach. This key point will be illustrate on a number of research projects, in which integrated experimental methodologies have been developed to study, e.g., ductile damage evolution in steels, interface delamination in flexible and stretchable electronics or computer chips, and mechanical size effects and creep in metallic MEMS.

报告人简介：
Johan P. M. Hoefnagels (1976) obtained his M.Sc. and Ph.D. degrees in Applied Physics at the Eindhoven University of Technology (TU/e). His Ph.D. thesis "A novel diagnostic approach for studying silicon thin film growth" involved the development and implementation of three advanced optical diagnostics to enable in-situ and real-time studies of surface processes during thin film deposition. In 2005, he transferred to the field of mechanical engineering to become an assistant professor in the 'Mechanics of Materials' group of Prof. Marc G.D. Geers (TU/e). His current research activities focus on the experimental micromechanics of thin films and interfaces, with research projects on mechanical size effects, delamination in microsystems, ductile damage evolution, interface integrity of flexible and stretchable electronics, creep and fatigue in metallic MEMS, etc. In all these projects, the system’s mechanics is investigated from an integrated mechanical-microscopic approach to characterize the underlying (micro-)structure, employing the Multi-Scale lab under his supervision (www.mate.tue.nl/mate/laboratories ). He has (co?)authored 25+ journal publications, 35+ refereed proceedings/book contributions, and 6 granted research proposals (including a personal NWO-Rubicon and NWO-Veni grant). He acquired international research experience during extensive research visits at international institutes and universities (IMEC, Leuven, Belgium; SUNY, Albany, US; NIST, Gaithersburg, US; CSM, Golden, US; and Harvard Univ., Cambridge, US).