报告内容摘要

The advance of semiconductor technology is mainly due to the advances of materials, especially polymeric materials. These include the use of polymers as: adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics (low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level packages for device protection), embedded passives (high K capacitors, high Q inductors for high density PWB substrates), superhydrophobic self-cleaning lotus effect surfaces, etc. In this presentation, I will review some of the recent advances on nano-materials and nano-technologies that are currently being investigated for these types of applications, such as : lead-free flexible electrically conductive adhesives (ECAs) with flexible/stretchable properties, self assembly monolayer molecular wires for fine pitch and high current density interconnects, flip chip and wafer level underfills, nano lead-free alloys for low temperature interconnects, well-aligned carbon nanotubes and graphenes for high current and high thermal interface materials(TIMs), superhydrophobic self-clean lotus surface coatings and NanoMetal Assisted Chemical Etching for MEMS and high efficiency solar cell applications.

报告人简介

Prof. C. P. Wong is currently Dean of the Faculty of Engineering at the Chinese University of Hong Kong. He is on a no pay long leave from the Georgia Institute of Technology(GT) where he is a Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering. He received his B.S. degree from Purdue University, and his MS. and Ph.D. degrees from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University. Prior to joining GT in 1996, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992 for his seminal contributions to low-cost high-performance packaging of semiconductor devices and components.

He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Educational Activity Board Outstanding Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Institute-Endowed Chair, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006(hailed by the IEEE as “Father of Modern Semiconductor Packaging”), the Sigma Xi’s Monie Ferst Outstanding Educational Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the 2012 International Dresden Barkhausen Award from Germany.

He holds over 65 U.S. patents, and has published over 1,000 technical papers, co-authored and edited 10 books and is a member of the National Academy of Engineering of the USA since 2000.

欢迎广大老师和研究生参加！

联系人：门丽霞  62755723